Everything You Need To Know About Cell Phone Repair Micro Soldering

October 19, 2022

What is Micro Soldering?

Micro soldering is the process of joining ultra-fine wires and microelectronic components (small electronic components such as resistors, capacitors, and ultra-fine wires). When we have some problems like iPhone die and won’t come back to life? No display? Audio problems? Micro-soldering the motherboard of the mobile phone can solve these problem.

cell phone repair micro soldering

Micro Soldering tools and equipment

cell phone repair micro soldering requires higher precision than conventional welding. To achieve this level of precision, you should equip yourself with the correct micro soldering kit. Below are the most commonly used micro soldering tools and equipment.

Solder Paste

A fusible metal or alloy that can fuse two or more metals into a whole is called solder. Among the commonly used tin-lead solders, tin accounts for 62.7% and lead accounts for 37.3%. The melting point and freezing point of this kind of solder are both 183°C, which can be directly cooled from liquid to solid state. The solder joint can be solidified rapidly, shortening the welding time and reducing virtual welding.

Solder Paste

Flux

Flux is a soldering aid material that acts as follows: Remove oxide film. Prevent oxidation. Reduce surface tension. Commonly used fluxes are rosin, rosin alcohol flux, solder paste, zinc chloride flux, ammonium chloride flux, etc.

Flux

Micro Soldering Microscope

When repairing mobile phones, some simple operations, such as planting tin, can use a magnifying glass, but more operations require a 20x or 40x microscope. A binocular stereo microscope or an electron microscope or a trinocular microscope is required. If you use an electron microscope, you still need to link a display screen to project the magnified image onto the screen. But the most commonly used is the stereoscopic binocular microscope.

Micro Soldering Microscope

Micro Soldering Rework Station

The soldering station is an upgrade of the soldering iron. The micro soldering iron temperature adjustment circuit is more complete and accurate, and the temperature return performance is better. It also has humanized functions such as automatic sleep, pick up and wake up. After using it, you will never want to use an ordinary electric soldering iron.

Micro Soldering Rework Station

Micro Soldering Hot Air Station

The Hot Air Station is one of the most used tools in mobile phone repair, and the process requirements are also very high. Heat guns are used from removing or installing small components. In different occasions, there are special requirements for the temperature and air volume of the hot air gun. Too low temperature will cause false soldering of components. If the temperature is too high, the components and circuit boards will be the worst. Excessive air volume will blow away small components.

Micro Soldering Hot Air Station

Micro Soldering Multimeter

It is one of the most commonly used maintenance instruments in mobile phone repair. It mainly tests the voltage of key points in each part, the continuity of the line, and the quality of the components. There are many types of multimeters on the market now, but they can be divided into two types, one is an pointer multimeter, and the other is a digital multimeter. Both types of multimeters have their own uses in cell phone repair, but digital multimeters are widely used for their high accuracy and intuitiveness.

Micro Soldering Multimeter

Schematic and bitmap

To repair the motherboard, you need to check the schematic and bitmaps. There are many types of mobile phone circuit diagram bitmaps, such as ZXW, Wuxinji, JC drawing account, mechanic account. They all support iPhone, iPad, and Android phones.

Schematic and bitmap

How to Micro Solder?

1. Prepare for Soldering

Hold the welding wire in the left hand and the soldering iron in the right hand, and enter the welding state. The tip of the soldering iron is required to be kept clean, free of oxides such as solder slag, and plated with a layer of solder on the surface.

2. Heating the weldment

The tip of the soldering iron rests on the junction of the two weldments and heats the entire weldment for about 1 to 2 seconds. For soldering components on the printed board, pay attention to make the tip of the soldering iron contact two objects to be soldered at the same time.

3. Feed the welding wire

When the welding surface of the weldment is heated to a certain temperature, the solder wire contacts the weldment from the opposite side of the soldering iron. (Note: do not send the solder wire to the tip of the soldering iron)

4. Remove the welding wire

When the welding wire has melted a certain amount, immediately remove the welding wire in the direction of 45° to the upper left.

5. Remove the soldering iron

After the solder wets the pad and the welding part of the weldment, remove the soldering iron 45° up to the right to end the soldering. From the start of the third step to the end of the fifth step, the time is also about 1 to 2s.



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